Qualcomm Snapdragon 8s Gen 3
The Qualcomm Snapdragon 8s Gen 3 is a SOC manufactured by Qualcomm, built on Qualcomm's officially announced Hexagon process technology. This processor features a 8-core architecture design. The Thermal Design Power (TDP) is rated at 6 W, equipped with 8 MB of L3 cache. Overall specifications are targeted at mainstream high-performance application scenarios.
Process
4 nm
Cores
8
TDP
6 W
L2 cache
1 MB
Memory Type
LPDDR5X
Max bandwidth
67.2 Gbit/s
CPU
Architecture
1x 3 GHz – Cortex-X44x 2.8 GHz – Cortex-A7203x 2 GHz – Cortex-A520
Frequency
3000 MHz
Cores
8
Instruction set
ARMv9.2-A
L2 cache
1 MB
L3 cache
8 MB
Process
4 nm
TDP
6 W
Manufacturing
TSMC
Graphics
GPU name
Adreno 735
GPU frequency
1100 MHz
Execution units
2
Shading units
256
Vulkan version
1.3
OpenCL version
2.0
DirectX version
12.1
Memory
Memory Type
LPDDR5X
Memory frequency
4200 MHz
Bus
4x 16 Bit
Max bandwidth
67.2 Gbit/s
AI
NPU
Hexagon
Multimedia (ISP)
Neural processor (NPU)
Hexagon
Storage type
UFS 3.1, UFS 4.0
Max display resolution
3840 x 2160
Max camera resolution
1x 200MP
Video capture
4K at 60FPS
Video playback
4K at 120FPS
Video codecs
- H.264- H.265- AV1- VP8- VP9
Audio codecs
- AAC- AIFF- CAF- MP3- MP4- WAV
Connectivity
4G support
LTE Cat. 22
5G support
Yes
Download speed
Up to 6500 Mbps
Upload speed
Up to 3500 Mbps
Wi-Fi
7
Bluetooth
5.4
Navigation
GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC