Qualcomm Snapdragon X X1 26 100 vs HiSilicon Kirin 8000
SOC · Specs Compare
General Parameters
Release Date
Jan 2025
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Manufacturer
Qualcomm
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Type
Laptop
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Instruction Set
ARMv9
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Core Architecture
Snapdragon X
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Processor Number
X1-26-100
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Integrated Graphics
Qualcomm Adreno X1-45
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Package
Manufacturing Process
4 nm
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Socket
Custom
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Power Consumption
15-30 W
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CPU Performance
Performance Cores
8
—
Performance Core Threads
8
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Performance Core Base Frequency
2.98 GHz
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Total Core Count
8
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Total Thread Count
8
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Multiplier
29
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L2 Cache
1536 K per core
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L3 Cache
6 MB shared
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Unlocked Multiplier
No
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Memory Parameters
Memory Types
LPDDR5X-8448
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Max Memory Size
64 GB
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Max Memory Channels
8
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Max Memory Bandwidth
135 GB/s
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ECC Memory Support
No
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Graphics Card Parameters
Integrated Graphics
true
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GPU Base Frequency
280 MHz
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GPU Max Dynamic Frequency
1107 MHz
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Shader Units
1024
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Texture Units
48
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Raster Operation Units
24
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Execution Units
3
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Power Consumption
30
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Miscellaneous
PCIe Version
4.0
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CPU
Architecture
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1x 2.4 GHz – 1xA77 H3x 2.19 GHz – 1xA77 L4x 1.84 GHz – A55
Frequency
—
2400 MHz
Cores
—
8
Instruction set
—
ARMv8.2-A
Process
—
7 nm
Manufacturing
—
SMIC
Graphics
GPU name
—
Mali-G610 MP4
GPU frequency
—
864 MHz
Shading units
—
128
Vulkan version
—
1.3
OpenCL version
—
2.0
Memory
Memory Type
—
LPDDR5
Memory frequency
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3200 MHz
Bus
—
4x 16 Bit
Max bandwidth
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51.2 Gbit/s
AI
NPU
—
Yes
Multimedia (ISP)
Storage type
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UFS 2.2, UFS 3.1
Video capture
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4K at 30FPS, 1K at 60FPS
Video playback
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4K at 30FPS, 1080p at 60FPS
Video codecs
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- H.264- H.265- VP9
Audio codecs
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- AAC- AIFF- CAF- MP3- MP4- WAV
Connectivity
5G support
—
Yes
Wi-Fi
—
6
Bluetooth
—
5.2
Navigation
—
GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC
Info
Announced
—
Oct 2024
Class
—
Mid range
Benchmark
Cinebench R23
975
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Cinebench R23
6,901
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Geekbench 6
2,121
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Geekbench 6
10,516
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Cinebench 2024
96
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Cinebench 2024
646
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▲ Specs Compare
Data sourced from official specifications and benchmark tests.