HiSilicon Kirin 970 vs Qualcomm Snapdragon 888 Plus
SOC · Specs Compare
CPU
Architecture
4x 2.36 GHz – Cortex A734x 1.84 GHz – Cortex A53
1x 2.995 GHz – Kryo 680 Prime (Cortex-X1)3x 2.42 GHz – Kryo 680 Gold (Cortex-A78)4x 1.8 GHz – Kryo 680 Silver (Cortex-A55)
Frequency
2360 MHz
2995 MHz
Cores
8
8
Instruction set
ARMv8-A
ARMv8.4-A
L1 cache
512 KB
512 KB
L2 cache
0
0
L3 cache
0
0
Process
10 nm
5 nm
Transistor count
5.5
10.3
TDP
9 W
8 W
Manufacturing
TSMC
Samsung
Graphics
GPU name
Mali-G72 MP12
Adreno 660
GPU frequency
768 MHz
905 MHz
Execution units
12
2
Shading units
18
512
Vulkan version
1.3
1.1
OpenCL version
2.0
2.0
DirectX version
12
12.1
Memory
Memory Type
LPDDR4X
LPDDR5
Memory frequency
1866 MHz
3200 MHz
Bus
4x 16 Bit
4x 16 Bit
Max bandwidth
29.8 Gbit/s
51.2 Gbit/s
Multimedia (ISP)
Neural processor (NPU)
Yes
Hexagon 780
Storage type
UFS 2.1
UFS 3.0, UFS 3.1
Max display resolution
3120 x 1440
3840 x 2160
Max camera resolution
1x 48MP, 2x 20MP
1x 200MP, 2x 25MP
Video capture
4K at 30FPS
8K at 30FPS, 4K at 120FPS
Video playback
4K at 30FPS
8K at 30FPS
Video codecs
H.264, H.265, VP8, VP9, VC-1
H.264, H.265, VP8, VP9
Audio codecs
32 bit@384 kHz, HD-audio
AAC, AIFF, CAF, MP3, MP4, WAV
Connectivity
4G support
LTE Cat. 18
LTE Cat. 22
5G support
No
Yes
Download speed
Up to 1200 Mbps
Up to 7500 Mbps
Upload speed
Up to 150 Mbps
Up to 3000 Mbps
Wi-Fi
5
6
Bluetooth
4.2
5.2
Navigation
GPS, GLONASS, Beidou, Galileo
GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, NAVIC
Info
Announced
Sep 2017
Jun 2021
Class
Flagship
Flagship
Model number
Hi3670
SM8350-AC
Benchmark
AnTuTu 10
355,946
836,957
Geekbench 6
386
1,230
Geekbench 6
1,377
3,778
FP32 (float)
331
1,853
▲ Specs Compare
Data sourced from official specifications and benchmark tests.