HiSilicon Kirin 8000 vs Qualcomm Snapdragon X Plus (X1P-64-100)
SOC · Specs Compare
CPU
Architecture
1x 2.4 GHz – 1xA77 H3x 2.19 GHz – 1xA77 L4x 1.84 GHz – A55
—
Frequency
2400 MHz
—
Cores
8
—
Instruction set
ARMv8.2-A
—
Process
7 nm
—
Manufacturing
SMIC
—
Graphics
GPU name
Mali-G610 MP4
—
GPU frequency
864 MHz
—
Shading units
128
—
Vulkan version
1.3
—
OpenCL version
2.0
—
Memory
Memory Type
LPDDR5
—
Memory frequency
3200 MHz
—
Bus
4x 16 Bit
—
Max bandwidth
51.2 Gbit/s
—
AI
NPU
Yes
—
Multimedia (ISP)
Storage type
UFS 2.2, UFS 3.1
—
Video capture
4K at 30FPS, 1K at 60FPS
—
Video playback
4K at 30FPS, 1080p at 60FPS
—
Video codecs
- H.264- H.265- VP9
—
Audio codecs
- AAC- AIFF- CAF- MP3- MP4- WAV
—
Connectivity
5G support
Yes
—
Wi-Fi
6
—
Bluetooth
5.2
—
Navigation
GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC
—
Info
Announced
Oct 2024
—
Class
Mid range
—
General Parameters
Release Date
—
Apr 2024
Manufacturer
—
Qualcomm
Type
—
Laptop
Instruction Set
—
ARMv9
Core Architecture
—
Snapdragon X
Processor Number
—
X1P-64-100
Integrated Graphics
—
Qualcomm Adreno X1
Package
Manufacturing Process
—
4 nm
Socket
—
Custom
Power Consumption
—
23 W
CPU Performance
Performance Cores
—
10
Performance Core Threads
—
10
Performance Core Base Frequency
—
3.4 GHz
Total Core Count
—
10
Total Thread Count
—
10
Multiplier
—
34x
L3 Cache
—
42 MB
Unlocked Multiplier
—
No
Memory Parameters
Memory Types
—
LPDDR5X-8448
Max Memory Size
—
64 GB
Max Memory Channels
—
8
Max Memory Bandwidth
—
135 GB/s
ECC Memory Support
—
No
Graphics Card Parameters
Integrated Graphics
—
true
GPU Base Frequency
—
500 MHz
GPU Max Dynamic Frequency
—
1200 MHz
Shader Units
—
1536
Texture Units
—
48
Raster Operation Units
—
6
Execution Units
—
6
AI Accelerator
NPU
—
Qualcomm Hexagon NPU
Theoretical performance
—
45 TOPS
Miscellaneous
PCIe Version
—
4.0
Benchmark
Cinebench R23
—
1,469
Cinebench R23
—
11,764
Geekbench 6
—
2,347
Geekbench 6
—
12,970
Passmark CPU
—
3,208
Passmark CPU
—
21,700
▲ Specs Compare
Data sourced from official specifications and benchmark tests.