HiSilicon Kirin 8000 vs Qualcomm Snapdragon 845

SOC · Specs Compare

SOC HiSilicon Kirin 8000

SOC Qualcomm Snapdragon 845 Qualcomm

CPU

Architecture

1x 2.4 GHz – 1xA77 H3x 2.19 GHz – 1xA77 L4x 1.84 GHz – A55

4x 2.8 GHz – Kryo 385 Gold (Cortex-A75)4x 1.8 GHz – Kryo 385 Silver (Cortex-A55)

Frequency

2400 MHz

2800 MHz

Cores

Instruction set

ARMv8.2-A

Process

7 nm

10 nm

Manufacturing

SMIC

Samsung

L1 cache

—

128 KB

L2 cache

—

L3 cache

—

Transistor count

—

TDP

—

9 W

Graphics

GPU name

Mali-G610 MP4

Adreno 630

GPU frequency

864 MHz

710 MHz

Shading units

128

256

Vulkan version

1.3

1.1

OpenCL version

2.0

Execution units

—

DirectX version

—

12.1

Memory

Memory Type

LPDDR5

LPDDR4X

Memory frequency

3200 MHz

1866 MHz

Bus

4x 16 Bit

2x 32 Bit

Max bandwidth

51.2 Gbit/s

29.8 Gbit/s

NPU

Yes

—

Multimedia (ISP)

Storage type

UFS 2.2, UFS 3.1

UFS 2.1

Video capture

4K at 30FPS, 1K at 60FPS

4K at 60FPS

Video playback

4K at 30FPS, 1080p at 60FPS

4K at 60FPS

Video codecs

- H.264- H.265- VP9

H.264, H.265, VP9

Audio codecs

- AAC- AIFF- CAF- MP3- MP4- WAV

AAC, AIFF, CAF, MP3, MP4, WAV

Neural processor (NPU)

—

Hexagon 685

Max display resolution

—

3840 x 2160

Max camera resolution

—

1x 192MP

Connectivity

5G support

Yes

Wi-Fi

Bluetooth

5.2

5.0

Navigation

GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC

GPS, GLONASS, Beidou, Galileo, QZSS, SBAS

4G support

—

LTE Cat. 18

Download speed

—

Up to 1200 Mbps

Upload speed

—

Up to 150 Mbps

Info

Announced

Oct 2024

Dec 2017

Class

Mid range

Flagship

Model number

—

SDM845

Official page

—

↗

Benchmark

AnTuTu 10

—

448,489

Geekbench 6

—

566

Geekbench 6

—

2,075

FP32 (float)

—

727

▲ Specs Compare Data sourced from official specifications and benchmark tests.